Our range of ceramic substrates alumina substrate.
Ceramic substrate material.
In terms of structure and manufacturing process ceramic substrates can be divided into high temperature co firing multi layer ceramic substrates low temperature co firing ceramic substrates thick film ceramic substrates etc.
Substrates made from rubalit alumina ceramics rubalit 708 s with 96 al 2 o 3 this ceramic material is characterized by its extremely high strength and thermal conductivity.
Ceramic substrates such as alumina aluminum nitride and beryllium oxide are highly thermally conductive materials which transfer heat away from hot spots quickly and efficiently dissipating it over the whole surface.
Alumina and aln have been used for a long time as the standard substrate materials for fabricating electronic circuits in thick film technology.
Ceramtec offers the world s top ceramic materials for thick and thin film technology and provides ceramics optimally designed to meet customer specification profiles.
Curamik metallized ceramic substrates rogers curamik product suite offers best in class metallized ceramic substrates that enable higher power efficiency.
Ceramic substrates corning s ceramic substrates launched a global clean air movement optimized for high performance efficiency and flexibility our advanced ceramic substrates can meet the most demanding gasoline and diesel system needs in both light duty and heavy duty applications.
Beside this conventional application these ceramics have been proved as excellent substrate materials for thick film heater employments.
The advantages of alumina include high resistivity good mechanical and dielectric strength excellent thermal and corrosion stability and the ability to provide hermetic seals.
At present the ceramic substrate materials used include alumina beryllium oxide aluminum nitride silicon carbide and mullite.
Our curamik substrates consist of pure copper bonded or brazed to a ceramic substrate and are designed to carry higher currents provide higher voltage isolation and operate over a wide temperature range.
Among the ceramics employed as electronic substrates and packages the dominant material is alumina aluminum oxide al 2 o 3.
Zro 2 substrate have a high corrosion and abrasion resistance.
Ceramic materials include alumina al2o3 aluminum nitride aln and silicon nitride si3n4.
Aln substrate have a high oxidation and abrasion resistance.
Due to the high degree of purity and the fine grain structure it has a very high thermal conductivity up to 30 w mk.
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The dielectric strength is the highest of kerafol s ceramic substrate materials.
The ceramic substrates include copper layers for fabrication of circuit patterns heat sinks and other electronic structures.
